Telecom Equipment PCBA

Telecom Equipment PCBA

As the telecommunication industry continues to grow, so there is a growing demand for the use of PCBs and PCBAs in telecommunication equipment.

Beton Tech is a reliable and professional full-service PCBA assembly company specializing in prototyping and low-volume manufacturing of high-complexity field or telecom printed circuit board assemblies (PCBAs) to leading OEMs.

We have extensive experience in highly complex, highly configurable telecommunication equipment products, leveraging our extensive experience in manufacturing telecommunication equipment products, scaling from PCBA prototype stage to PCBA mass production.

  • Description

Our Telecom PCB Assembly Capabilities

The telecommunications industry is constantly changing and evolving in terms of advanced networking and telecommunications solutions. Our engineering team works closely with our customers to ensure they get the best telecom PCB assembly solution quickly. Our capabilities in telecommunications PCB assembly services include, but are not limited to, the following:



. Complex RoHS and non-RoHS PCA sizes up to 18x20.

PTH, SMT and mixed technology assembly.

Single and double sided assembly.

No-clean flux process and closed-loop water washing system.

Conformal coating and potting comply with IPC-CC-830B standards.

Cable and wire harness assembly.

Complete mechanical assembly.

Fixtures and fixtures-free in circuit and functional testing.

Repair/Rework including BGA and QFP

Laser alignment and vision systems for SMT placement.

SMT production line automatic calibration


What types of PCBs are used in the telecom PCB assembly industry?


PCBs are an important part of the telecommunications PCB assembly industry, they are critical to consumer devices such as smartphones, but also to the infrastructure that makes these devices function properly.In the telecommunications PCB assembly industry, the number of circuit board layers is generally 2-20 layers, mainly multi-layer.

The telecommunications industry pushes technology forward as it continually seeks to reduce size and weight while continually adding features for better performance, preventing competition from gaining ground. We can do this with low-cost, high-volume production capabilities that can support even the most complex existing 4G, ie 5G, optics, thermal management and signal integrity telecom PCB requirements.

The high-frequency PCB (RF PCB) and microwave PCB of many board factories have been widely used in telecommunication systems. We choose high-frequency laminates with strict steering to ensure the performance of the telecommunication PCB life cycle through high-quality production. We are familiar with the materials used to build high-frequency PCBs, generally Rogers, Arlon, Isola and other board companies.

We also use the latest ceramic materials and Teflon to reduce wear and tear on telecom PCB designs. We design telecom PCBs as HDI printed circuit boards, built with sequential build technology. In addition to this, we have also manufactured boards with metal core and metal back scales to allow heat dissipation through copper and tin heat sinks for optimum working conditions.




Telecom PCB assembly applications:


PCB is a necessity in the communications industry. From PCBs for broadcast networks to PCBs for office communications, printed circuit boards enable electronic communication devices. Its hard to imagine how we communicated before the advent of todays advanced communications technologies.

Thanks to the device and the Telecom PCB inside, we can connect to each other faster, clearer and more efficiently than ever before. Of course, to enjoy clear, fast, and effective communication, we need the right communication PCB printed circuit board to get the job done.

One popular use of Telecom PCB Assembly is for office communications. You'll find PCBs in telephone switching systems, video collaboration, PBX systems, and voice over Internet or VoIP equipment. Communications electronics PCBs are also used in general telecommunications systems such as base stations, satellites, high-speed routers and servers, and commercial telephone technology. Communication PCBs are also commonly used to control LED displays and indicators.

The telecommunications industry is constantly evolving, and so are the Telecom PCB components used in the industry. As we generate and transmit more data, powerful PCBs will become increasingly important for communications.

Challenges faced by Telecom Equipment PCBA

Challenges faced by Telecom Equipment PCBA

With the development of 5G technology, 5G communication products have strict requirements on the reliability, reliability, electrical performance, thermal performance and product quality of PCB, which puts forward higher requirements for the process and technology of PCB board manufacturers.


1. Requirements for PCB board factory hole technology

Blind and buried vias: 5G product functions have been improved, and the requirements for high-density PCBs have increased. Multi-level HDl products and even products interconnected in any order are increasingly in demand, and higher-level buried blind via capabilities need to be improved.

Back drilling stub puts forward more stringent requirements, ostub will be the trend.

Embedded copper: The heat dissipation of 5G communication high-frequency and high-power devices requires copper blocks to be embedded in the PCB to improve the heat dissipation capacity of the PCB.


2. Requirements for PCB board factory line and surface technology

Accuracy and consistency: 5G products continue to increase data signal transmission rates, so they have stricter requirements for product impedance, loss, etc. Product impedance requirements are increased from 10% to 5%, and line width tolerances need to be increased from 20% to 10%, the effect of line flatness on the signal.

Inner layer: Under the high speed or high frequency of 5G communication, the impedance felt when the signal is transmitted in the conductor will be much greater than the resistance of the conductor under DC conditions. For the traditional inner layer, the coarse accuracy is low and the rough accuracy Ra<0.5um

Interlayer: 5G is high-speed. The uniformity of the thickness of the dielectric layer will also affect the signal transmission characteristics. The requirement for the uniformity of the dielectric thickness is 15%. A management and control system for dielectric thickness control has been established for key locations such as "under the large copper surface BGA and impedance lines". , material mixing requirements.


3. Requirements for plate technology

Loss factor Df and insertion loss & consistency: With the increase in 5G communication speed and frequency, the demand for panel loss factor Df is getting smaller and smaller, and the requirements for insertion loss & consistency are getting higher and higher.

Temperature resistance: 5G high-frequency board consumption reduction: thin substrate material, high thermal conductivity, smooth copper foil surface, low loss factor and other materials, the PCB operating temperature increases, and the PCB board has a higher RT and higher thermal conductivity. Through simulation, it was found that high thermal conductivity (Tc) is more effective than reducing the D value of the material to reduce temperature rise. The trend of plate RT: upgrade from 105C to 150C.


4. Requirements for excipient technology

Solder mask ink: In addition to PCB design and material selection, the main factors that affect signal transmission quality are the selection of solder mask ink which also has a great impact on the outer high-speed lines. There is an urgent need for research and application of ultra-low loss ink.

Browning potion: Due to the skin effect of current, in high-frequency and high-speed fields, the roughness of the copper foil surface greatly affects circuit loss. Low-roughness browning potion is increasingly used in high-speed board processing.


Excellent PCBA quick prototype and small, medium and mass production


As an outstanding online PCBA fast prototype and small and medium-sized batch manufacturer, Beton has more than 10 years of production process experience and industry data. We are also in line with the technological development of the industry and constantly improve our own process level. High-end multi-layer boards and HDI have always been Our development direction and high product reliability are our commitment to our customers.

At present, Beton can handle the prototyping and small and medium-sized batches of 1-20 layer multi-layer boards and HDI 1-3 levels of PCBA. It also has certain leading advantages in impedance and lamination control. Adhering to the mission of assisting the high-quality development of the electronics industry, Beton hopes to cooperate with More industry personnel will work together to contribute to the development of the Telecom Equipment PCBA industry.