PCB Assembly Capabilities
| Item | Fabrication Capabilities |
| The assembly number of layers | 1-48 layers |
| Assembly PCB board type | Rigid PCB (FR-4, Metal Core PCB), Flexible PCB (FPC), Rigid-Flex PCB, Aluminum PCB |
| Maximum Assembly PCB Size | 400mm x 1200mm (min 50mm x 50mm) |
| Component size |
±01005（0.4mm * 0.2mm），0201 BGA and other high-precision ICs: we can detect BGA components with a Min 0.25mm pitch through X-ray |
| Board Thickness | 0.3mm ~4.5mmmm |
| The whole placement accuracy | 0.0375mm |
| Component packaging | Cut tape,Partial reel,Reel,Tube,Tray,stainless steel |
Production capacity |
SMT chip 4 million points/day, Post-plug soldering 500,000 points/day, 50-100 models/day |
| PCBA soldering type | SMT, THT, double-sided Assembly |
| Stencil | Using laser stencil to ensure small-pitch IC and BGA components assembly to meets IPC-2 Class or higher standards |
| False positive rate | ≤0.1% |
| Temperature accuracy | ±1℃ |
| Printing accuracy | ±25μm |
| X-Y axis accuracy | 0.5um |
| MOQ | 5pcs |
| Component services | Full set of substitute materials, OEM only, partial substitute materials |
File Type |
Bill of Materials/Components (BOM), PCB (Gerber files and most PCB design format files), coordinate files) |
| Test items | IQC, IPQC, visual QC, SPI inspection, AOI, X-Ray, functional test |
| Repair & Rework | BGA Rework Service |