Production Introduction
Layer Count | 2 layers | Electrical test | yes |
Board Type (Rigid/Flexiable) | Rigid | Impedance control | no |
Material Type | FR4 | Gold finger | no |
Surface Finish | HASL | Buried/Blind via | no |
Solder mask color | Green Soldermask x2 | Legend color | White Legend x2 |
The Electric Car PCBA Bom List
Designator | Footprint | Manuf_1 | Quantity | Assemble |
C1 | 2815 P | KEMET Electronics Corporation | 1 | Yes |
C2 | 1210C | KEMET Electronics Corporation | 1 | Yes |
C3 | 1206C | KEMET Electronics Corporation | 1 | Yes |
C4 | 1206C | KEMET Electronics Corporation | 1 | Yes |
D1 | SMB_(DO-214AA) | ON Semi | 1 | Yes |
L1 | WE1-PD2_5848 | SUMIDA | 1 | Yes |
L2 | WE1-PD2_5848 | SUMIDA | 1 | Yes |
LED1, LED2 | LED_0805_G | Elecsound Electronics Company Limited | 2 | Yes |
P1 | 64600211622 | Molex | 1 | Yes |
P2 | 64600311622 | Molex | 1 | Yes |
R2 | 0603R | Panasonic Electronic Components | 1 | Yes |
R3 | 0603R | Panasonic Electronic Components | 1 | Yes |
U1 | MJWI20 Single | TDK-Lambda | 1 | Yes |
How To Control The Quality Of Pcba Processing
(1) It is especially important to hold a pre-production meeting after receiving an order for processing pcba. It is mainly the process of analyzing PCBGerber files and submitting a Manufacturability Report (DFM) according to different customer requirements. Many small manufacturers don't take this seriously. But that's often the case. Not only is it prone to quality issues due to poor PCB design, but it also involves a lot of rework and repair work.
(2) Procurement and inspection of electronic components provided by pcba
Sourcing channels for electronic components must be strictly controlled, and goods must be sourced from large traders and original manufacturers to avoid the use of second-hand and counterfeit materials. In addition, it is necessary to set up a special pcba incoming inspection station to strictly check the following items to ensure that the components are fault-free.
PCB: Check the temperature test of the reflow oven, whether the through holes without flying leads are blocked or leaking, whether the board surface is bent, etc.
IC: Check that screen printing is exactly the same as screen printing. BOM, and store it under constant temperature and humidity.
(3) SMT assembly
Solder paste printing and reflow oven temperature control systems are critical points of assembly and require laser stencils with higher quality requirements and higher processing requirements. According to the needs of the PCB, some need to increase or decrease the steel mesh or U-shaped hole, only need to make the steel mesh according to the process requirements. Among them, the temperature control of the reflow oven is very important for the wetting of the solder paste and the firmness of the wire mesh, which can be adjusted according to the normal SOP operation guidelines. In addition, strict implementation of AOI testing can greatly reduce defects caused by human factors.
(4) Plug-in processing
In the plug-in process, the mold design of the wave soldering is the key. PE engineers must continue to practice and summarize how to use molds to maximize productivity.
(5) pcba processing board test
For orders with pcba test requirements, the main test contents include ICT (circuit test), FCT (functional test), burning test (aging test), temperature and humidity test, drop test, etc.